**********************************************************
The following is issued on behalf of the Hong Kong Monetary Authority:
Tender Date : June 26, 2013
Bonds available for Tender : Three-year RMB Bonds
Issue Number : BCMKFB13041
Issue Date : June 27, 2013
Maturity Date : June 27, 2016
(or the closest
Coupon payment date)
Application Amount : RMB 10,683 million
Issue Amount : RMB 5,000 million
Average accepted Coupon Rate : 2.71%
Highest accepted Coupon Rate
(Bonds' Coupon) : 2.87%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 63.07%
*****************************************************
Tender Date : June 26, 2013
Bonds available for Tender : Five-year RMB Bonds
Issue Number : BCMKFB13042
Issue Date : June 27, 2013
Maturity Date : June 27, 2018
(or the closest
Coupon payment date)
Application Amount : RMB 4,838 million
Issue Amount : RMB 2,000 million
Average accepted Coupon Rate : 2.83%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.02%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 23.38%
*****************************************************
Tender Date : June 26, 2013
Bonds available for Tender : Seven-year RMB Bonds
Issue Number : BCMKFB13043
Issue Date : June 27, 2013
Maturity Date : June 29, 2020
(or the closest
Coupon payment date)
Application Amount : RMB 2,764.5 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 2.94%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.09%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 99.92%
*****************************************************
Tender Date : June 26, 2013
Bonds available for Tender : Ten-year RMB Bonds
Issue Number : BCMKFB13044
Issue Date : June 27, 2013
Maturity Date : June 27, 2023
(or the closest
Coupon payment date)
Application Amount : RMB 2,127 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.01%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.16%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 90.34%
*****************************************************
Tender Date : June 26, 2013
Bonds available for Tender : Fifteen-year
RMB Bonds
Issue Number : BCMKFB13045
Issue Date : June 27, 2013
Maturity Date : June 27, 2028
(or the closest
Coupon payment date)
Application Amount : RMB 1,248 million
Issue Amount : RMB 500 million
Average accepted Coupon Rate : 3.40%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.60%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 57.05%
*****************************************************
Tender Date : June 26, 2013
Bonds available for Tender : Thirty-year RMB Bonds
Issue Number : BCMKFB13046
Issue Date : June 27, 2013
Maturity Date : June 29, 2043
(or the closest
Coupon payment date)
Application Amount : RMB 1,025 million
Issue Amount : RMB 500 million
Average accepted Coupon Rate : 3.85%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.95%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 88.75%
Ends/Wednesday, June 26, 2013
Issued at HKT 14:21
NNNN
